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- home > Supply > IC and the effect of thermal silica film bga _ Technology Co., Ltd. Shenzhen Kang guide
Information Name: | IC and the effect of thermal silica film bga _ Technology Co., Ltd. Shenzhen Kang guide |
Published: | 2014-10-29 |
Validity: | 30 |
Specifications: | Die according to customer requirements |
Quantity: | 50000.00 |
Price Description: | |
Detailed Product Description: | Meanwhile thermal silica film as a novel electronic interface materials with high thermal conductivity of both softness. Usually early in the design thermal silica film should be added to the structural design and hardware, circuit design. The major design considerations include: thermal conductivity considerations, structural considerations, EMC considerations, shock absorbing considerations, installation and testing and so on. Thermal silica film is a high performance thermal conductivity thermal filler between heat products are mainly used in electronic chip and heat sink or housing, mainly plays the role of heat conduction, with their slightly viscous, soft, compressible. In the electronic components and the use of air between the heat sink can be completely discharged, in order to achieve full contact, so that the effect is more apparent thermal conductivity, thermal silica films wider range of applications, and more generally for the LED lights. Thermal silica film Application: electrical and electronic products for material control board, inside the motor, external pads and mats, electronics, auto mechanics, mainframe computer, laptop, DVD, VCD and any need for filling and cooling modules . Widely used in optoelectronics industry (flat panel displays, outdoor displays, LCD-TV, TFT-LCD, built-in power modules, backlight module, LED lighting), the computer industry (notebook computers, tablet computers, computer peripherals related equipment , PC host, workstations, network servers, PC servers), network industries (switches, hubs, routers, network cards, modems, transmission equipment) appliance industry (water dispenser, stove, air conditioning) communications industry (smart phones, walkie-talkies) Other industries (semiconductor lighting equipment, test / control medical equipment, power supply module) and the like. Kang guide brand thermal silica films Category Model: KD-CF300 thermal silica films: KD-CF300 thermal silica film is a high performance thermally conductive gap filling materials, mainly for passing interface electronics enclosure and heat sink or product between. Thermal silica film has good adhesion, flexibility, good compression performance and excellent thermal conductivity. So that, in use, completely air between the heat sink and the electronic components is discharged, in order to achieve sufficient contact, significantly increase the cooling effect. KD-CF300 thermal silica film has a slightly viscous than conventional thermal insulation materials bring great convenience during installation of the product, easy off, easy to operate. KD-CB150 adhesive thermal silica films: KD-CB150 series is adhesive thermal silica films, with a strong adhesive, mainly for non-heat conduction between the fastening means between the heating device and the heat sink or product housing. KD-CP150 back silicone thermal silica films: KD-CP150 back silicone thermal silica films, mainly for low-tightening pressure demanding applications. Low modulus polymer attached to the glass fiber substrate composed; between the contact surfaces of the machine can be used as a filler interface. KD-CG150 with fiberglass thermal silica films: KD-CG series is a high performance thermal interface products, silicon-containing compound resin, boron nitride and glass fiber. The product is good toughness, strong. Is a high shear strength, resistance to puncture resistance to tearing products. Duplicating a soft coating on the low-pressure center Fang film, submerged installation provides excellent mating surfaces. While products with multi-style thermal properties, suitable for any application. KD-CS500 high thermal silica films: KD-CS500 high thermal silica films, with very good use of high thermal conductivity and obedient nature, with unparalleled thermal conductivity at the interface gap filling material. Thermal silica film application modes: 1, TFT-LCD notebook computers, mainframe computers; 2, power devices (power supply, computer, telecommunications), automotive electronics module (engine wiper) power module, power supply, calculator application (CPU, GPU, USICS, hard drives), and any place where heat needs to be filled; 3, electronic products, electronic equipment, heating power devices (integrated circuits, power transistor, SCR, transformers, etc.) and the cooling facilities (for cooling sheet, aluminum housing and other close contact between), to achieve better thermal effect 4, high power LED lighting, high power LED spotlights, lights, fluorescent lights and the like; 5, customers can gap between the heating element and heat sink according to size to select the appropriate temperature thermal silica film thickness up to (-40 ~ + 220); color adjustable, thickness optional. Thermal silica film performance parameters: Item Test Method Unit KD-CF300 test values ??Visual color gray / black thickness ASTM D374 mm 0.3 ~ 20.0 gravity ASTM D792 g / cm3 1.8 ± 0.1 Hardness ASTM D2240 Shore C 18 ± 5 ~ 40 ± 5 anti- Tensile Strength ASTM D412 kg / cm2 8 temperature range EN344 ℃ -40 ~ + 220 volume resistivity ASTM D257 Ω-cm 1.0 * 1011 Withstand voltage ASTM D149 KV / mm 4 flame retardant UL-94 V-0 Thermal conductivity ASTM D5470 w / mk 3.0 thermal silica film Features Benefits: compressibility strong, soft and elastic high thermal conductivity of both the natural stickiness, no additional amount of adhesive surface to meet the environmental requirements of ROHS and UL thermal silica film applications: circuit board and heat sink thickness, hardness thermally conductive silicone film filled with padding and filling IC IC and similar heatsink cooling materials or products between the housing (such as metal shield) between the design can be adjusted according to different, so you can heat conduction channel Bridging the cooling structure, the size of the chip and other poor workers, reducing the flatness of the structural design of the heat sink member contact surface roughness working poor requirements. Now the new cooling solution is to remove the traditional radiator, the radiator into a unified structure and heat dissipation structure, replace the fan, thus improving the reliability of the system. While also reducing the overall cost of cooling solutions. |
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Copyright © GuangDong ICP No. 10089450, Technology Co., Ltd. Shenzhen Kang guide All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
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You are the 5519 visitor
Copyright © GuangDong ICP No. 10089450, Technology Co., Ltd. Shenzhen Kang guide All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility